Leveraging advanced AI machinery, MEI delivers precise and reliable through-hole component insertion — covering Jumper Wire, Radial, and Axial components at a capacity of 10 million insertions per month.

Equipped with 6 high-speed SMT lines, MEI delivers a production capacity of 50 million mounting points per month — supporting fine pitch IC, QFP, BGA mounting and leadfree processes to meet the highest industry standards.

MEI's Manual Insertion operations comprise 4 conveyor-based production lines, managed by experienced operators to ensure precision at every stage — encompassing component assembly, soldering, functional testing, and final packaging.

Quality is at the core of everything we do at MEI. Through rigorous inspection, testing, and ISO 9001-certified processes, we ensure every product meets the highest standards — delivering consistent reliability and customer satisfaction at every stage of production.

MEI has the capability to perform semiconductor processes including Die Attachment, Wire Bonding, and Semiconductor Testing. We primarily serve clients requiring COB (Chip-on-Board) processes, where a semiconductor component is mounted directly onto a PCB or Flex circuit — with connections performed using a wire bonding machine utilising gold or aluminium wire.

MEI delivers flexible OEM, ODM, and Turnkey EMS solutions — providing clients with a complete manufacturing partnership from design support and assembly through to testing, packaging, and delivery.